Standard Configurations
? Special vacuum mounting technology without roller (Roller mounting Optional)
? Fully Automatic Wafer / Frame Loading & Unloading;
? Horizontal multi axis transfer robot for wafer transfer
? Vacuum fork for wafer handing
? Wafer alignment
? Wafer cassette loading
? Automatic Wafer Mapping in cassette
? ESD Mounting Roller and ESD Teflon Plating Contact Wafer Chuck;
? Industrial PC Based Control with 17” Touch Panel LCD;
? Compatible with normal wafer and thinner wafer;
? Compatible with 6” & 8” Frame;
? Non-UV & UV tape capability;

Options
? Wafer BG tape Detaping funtion
? Wafer OCR & Labling funtion
? Handling Wafer Box function
? Various Contact chuck to handle various wafer
? Non-contact wafer handling
? Bernoulli arm for ultra thinner wafer handling

Performances
Wafer Yield >= 99.9 (not include damage wafers)
Mounting Quality No Air Bubble (not include particle bubble)
UPH >= 60 PCs Wafer
MTBF > 168 Hours
MTTR < 1 Hour
Down Time < 3
Conversion Time <= 20 Minutes